Vulnerabilities (CVE)

Filtered by vendor Qualcomm Subscribe
Filtered by product Mdm9206
Total 746 CVE
CVE Vendors Products Updated CVSS v2 CVSS v3
CVE-2017-18303 1 Qualcomm 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more 2024-11-21 7.2 HIGH 7.8 HIGH
While processing the sensors registry configuration file, if inputs are not validated a buffer overflow will occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MMDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20.
CVE-2017-18300 1 Qualcomm 16 Mdm9206, Mdm9206 Firmware, Mdm9607 and 13 more 2024-11-21 4.9 MEDIUM 5.5 MEDIUM
Secure display content could be accessed by third party trusted application after creating a fault in other trusted applications in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SDA660.
CVE-2017-18299 1 Qualcomm 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more 2024-11-21 4.9 MEDIUM 5.5 MEDIUM
Improper translation table consolidation logic leads to resource exhaustion and QSEE error in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660
CVE-2017-18298 1 Qualcomm 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more 2024-11-21 7.2 HIGH 7.8 HIGH
Lack of Input Validation in SDMX API can lead to NULL pointer access in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 .
CVE-2017-18296 1 Qualcomm 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more 2024-11-21 7.2 HIGH 7.8 HIGH
Access control on applications is not applied while accessing SafeSwitch services can lead to improper access in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDA660, SDX20.
CVE-2017-18295 1 Qualcomm 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more 2024-11-21 7.2 HIGH 7.8 HIGH
Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20.
CVE-2017-18294 1 Qualcomm 48 Fsm9055, Fsm9055 Firmware, Mdm9206 and 45 more 2024-11-21 7.2 HIGH 7.8 HIGH
While reading file class type from ELF header, a buffer overread may happen if the ELF file size is less than the size of ELF64 header size in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDA660, SDX20.
CVE-2017-18293 1 Qualcomm 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more 2024-11-21 7.2 HIGH 7.8 HIGH
When a particular GPIO is protected by blocking access to the corresponding GPIO resource registers, the protection can be bypassed using the corresponding banked GPIO registers instead in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
CVE-2017-18282 1 Qualcomm 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more 2024-11-21 7.2 HIGH 7.8 HIGH
Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
CVE-2017-18279 1 Qualcomm 78 Fsm9055, Fsm9055 Firmware, Fsm9955 and 75 more 2024-11-21 7.2 HIGH 7.8 HIGH
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016.
CVE-2017-18278 1 Qualcomm 34 Mdm9206, Mdm9206 Firmware, Mdm9607 and 31 more 2024-11-21 7.2 HIGH 7.8 HIGH
An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850.
CVE-2017-18277 1 Qualcomm 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more 2024-11-21 4.9 MEDIUM 5.5 MEDIUM
When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835.
CVE-2017-18276 1 Qualcomm 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more 2024-11-21 7.2 HIGH 7.8 HIGH
Secure camera logic allows display/secure camera controllers to access HLOS memory during secure display or camera session in Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850
CVE-2017-18275 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 4.9 MEDIUM 5.5 MEDIUM
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845.
CVE-2017-18274 1 Qualcomm 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more 2024-11-21 7.2 HIGH 7.8 HIGH
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
CVE-2017-18157 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 7.2 HIGH 7.8 HIGH
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
CVE-2017-18156 1 Qualcomm 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more 2024-11-21 7.2 HIGH 7.8 HIGH
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
CVE-2017-18146 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail.
CVE-2017-18141 1 Qualcomm 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more 2024-11-21 7.2 HIGH 7.8 HIGH
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVE-2017-18140 1 Qualcomm 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.