CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
References
Configurations

Configuration 1 (hide)

AND
cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*

Configuration 2 (hide)

AND
cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*

Configuration 3 (hide)

AND
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9650:-:*:*:*:*:*:*:*

Configuration 4 (hide)

AND
cpe:2.3:o:qualcomm:msm8909w_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:msm8909w:-:*:*:*:*:*:*:*

Configuration 5 (hide)

AND
cpe:2.3:o:qualcomm:msm8996au_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:msm8996au:-:*:*:*:*:*:*:*

Configuration 6 (hide)

AND
cpe:2.3:o:qualcomm:sd_210_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_210:-:*:*:*:*:*:*:*

Configuration 7 (hide)

AND
cpe:2.3:o:qualcomm:sd_212_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_212:-:*:*:*:*:*:*:*

Configuration 8 (hide)

AND
cpe:2.3:o:qualcomm:sd_205_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_205:-:*:*:*:*:*:*:*

Configuration 9 (hide)

AND
cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_425:-:*:*:*:*:*:*:*

Configuration 10 (hide)

AND
cpe:2.3:o:qualcomm:sd_450_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_450:-:*:*:*:*:*:*:*

Configuration 11 (hide)

AND
cpe:2.3:o:qualcomm:sd_615_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_615:-:*:*:*:*:*:*:*

Configuration 12 (hide)

AND
cpe:2.3:o:qualcomm:sd_616_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_616:-:*:*:*:*:*:*:*

Configuration 13 (hide)

AND
cpe:2.3:o:qualcomm:sd_415_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_415:-:*:*:*:*:*:*:*

Configuration 14 (hide)

AND
cpe:2.3:o:qualcomm:sd_625_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_625:-:*:*:*:*:*:*:*

Configuration 15 (hide)

AND
cpe:2.3:o:qualcomm:sd_650_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_650:-:*:*:*:*:*:*:*

Configuration 16 (hide)

AND
cpe:2.3:o:qualcomm:sd_652_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_652:-:*:*:*:*:*:*:*

Configuration 17 (hide)

AND
cpe:2.3:o:qualcomm:sd_820_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_820:-:*:*:*:*:*:*:*

Configuration 18 (hide)

AND
cpe:2.3:o:qualcomm:sd_820a_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_820a:-:*:*:*:*:*:*:*

Configuration 19 (hide)

AND
cpe:2.3:o:qualcomm:sd_835_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_835:-:*:*:*:*:*:*:*

Configuration 20 (hide)

AND
cpe:2.3:o:qualcomm:sd_845_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sd_845:-:*:*:*:*:*:*:*

Configuration 21 (hide)

AND
cpe:2.3:o:qualcomm:sdx20_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:sdx20:-:*:*:*:*:*:*:*

History

No history.

Information

Published : 2019-05-06 23:29

Updated : 2024-02-28 17:08


NVD link : CVE-2017-18157

Mitre link : CVE-2017-18157

CVE.ORG link : CVE-2017-18157


JSON object : View

Products Affected

qualcomm

  • mdm9607_firmware
  • sd_212_firmware
  • sd_450
  • mdm9206
  • sd_210
  • msm8909w_firmware
  • sd_845
  • sd_835_firmware
  • sdx20_firmware
  • sd_845_firmware
  • mdm9650_firmware
  • mdm9650
  • msm8909w
  • sd_205
  • sd_650_firmware
  • sd_210_firmware
  • sd_425
  • sd_615
  • sdx20
  • msm8996au
  • sd_616
  • sd_625
  • mdm9206_firmware
  • sd_650
  • sd_652_firmware
  • sd_450_firmware
  • sd_415_firmware
  • sd_425_firmware
  • sd_835
  • msm8996au_firmware
  • sd_652
  • sd_615_firmware
  • sd_616_firmware
  • sd_212
  • sd_625_firmware
  • sd_820a_firmware
  • sd_205_firmware
  • sd_820_firmware
  • sd_820
  • sd_820a
  • mdm9607
  • sd_415
CWE
CWE-416

Use After Free