Total
746 CVE
CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
---|---|---|---|---|---|
CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | |||||
CVE-2018-11268 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | |||||
CVE-2018-11267 | 1 Qualcomm | 78 Mdm9206, Mdm9206 Firmware, Mdm9607 and 75 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. | |||||
CVE-2018-11264 | 1 Qualcomm | 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660. | |||||
CVE-2018-11259 | 1 Qualcomm | 76 Mdm9206, Mdm9206 Firmware, Mdm9607 and 73 more | 2024-11-21 | 3.6 LOW | 7.7 HIGH |
Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition. | |||||
CVE-2018-11258 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | 4.6 MEDIUM | 7.8 HIGH |
In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | |||||
CVE-2017-8276 | 1 Qualcomm | 66 Mdm9206, Mdm9206 Firmware, Mdm9607 and 63 more | 2024-11-21 | 4.6 MEDIUM | 7.8 HIGH |
Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
CVE-2017-8274 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, an access control vulnerability exists in Core. | |||||
CVE-2017-8252 | 1 Qualcomm | 110 Ipq4019, Ipq4019 Firmware, Ipq8074 and 107 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
Kernel can inject faults in computations during the execution of TrustZone leading to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, SM7150, Snapdragon_High_Med_2016, SXR1130 | |||||
CVE-2017-18331 | 1 Qualcomm | 22 Mdm9206, Mdm9206 Firmware, Mdm9607 and 19 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Improper access control on secure display buffers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 820, SD 820A, SD 835, SDA660 | |||||
CVE-2017-18330 | 1 Qualcomm | 78 Ipq8074, Ipq8074 Firmware, Mdm9206 and 75 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
CVE-2017-18328 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. | |||||
CVE-2017-18324 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016. | |||||
CVE-2017-18323 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. | |||||
CVE-2017-18322 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
CVE-2017-18319 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
CVE-2017-18316 | 1 Qualcomm | 40 Mdm9206, Mdm9206 Firmware, Mdm9607 and 37 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Secure application can access QSEE kernel memory through Ontario kernel driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDA845, SDX24, SXR1130. | |||||
CVE-2017-18314 | 1 Qualcomm | 74 Mdm9206, Mdm9206 Firmware, Mdm9607 and 71 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | |||||
CVE-2017-18305 | 1 Qualcomm | 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more | 2024-11-21 | 6.9 MEDIUM | 7.0 HIGH |
XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835. | |||||
CVE-2017-18304 | 2 Qaulcomm, Qualcomm | 52 Fsm9055, Fsm9055 Firmware, Mdm9206 and 49 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
Insufficient memory allocation in boot due to incorrect size being passed could result in out of bounds access in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version FSM9055, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660 and SDX20 |