Total
257 CVE
CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
---|---|---|---|---|---|
CVE-2018-11966 | 1 Qualcomm | 84 Mdm9150, Mdm9150 Firmware, Mdm9206 and 81 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SM7150, Snapdragon_High_Med_2016, SXR1130 | |||||
CVE-2017-18326 | 1 Qualcomm | 68 Mdm9607, Mdm9607 Firmware, Mdm9615 and 65 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. | |||||
CVE-2018-11288 | 1 Qualcomm | 40 Mdm9206, Mdm9206 Firmware, Mdm9607 and 37 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
Possible undefined behavior due to lack of size check in function for parameter segment_idx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDX24, SXR1130 | |||||
CVE-2018-5877 | 1 Qualcomm | 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
In the device programmer target-side code for firehose, a string may not be properly NULL terminated can lead to a incorrect buffer size in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 600, SD 820, SD 820A, SD 835, SDA660, SDX20. | |||||
CVE-2017-18322 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
CVE-2017-18321 | 1 Qualcomm | 8 Mdm9650, Mdm9650 Firmware, Mdm9655 and 5 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
Security keys used by the terminal and NW for a session could be leaked in snapdragon mobile in versions MDM9650, MDM9655, SD 835, SDA660. | |||||
CVE-2018-11847 | 1 Qualcomm | 66 Ipq8074, Ipq8074 Firmware, Mdm9206 and 63 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016 | |||||
CVE-2018-5839 | 1 Qualcomm | 60 Mdm9150, Mdm9150 Firmware, Mdm9615 and 57 more | 2024-02-28 | 6.6 MEDIUM | 7.1 HIGH |
Improperly configured memory protection allows read/write access to modem image from HLOS kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in versions MDM9150, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8996AU, QCS605, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX20, SXR1130. | |||||
CVE-2018-11289 | 1 Qualcomm | 84 Ipq8074, Ipq8074 Firmware, Mdm9150 and 81 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
CVE-2018-11996 | 1 Qualcomm | 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
When a malformed command is sent to the device programmer, an out-of-bounds access can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 600, SD 820, SD 820A, SD 835, SDA660, SDX20, SDX24. | |||||
CVE-2017-18328 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. | |||||
CVE-2018-11935 | 1 Qualcomm | 56 Mdm9607, Mdm9607 Firmware, Mdm9650 and 53 more | 2024-02-28 | 5.0 MEDIUM | 5.3 MEDIUM |
Improper input validation might result in incorrect app id returned to the caller Instead of returning failure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130. | |||||
CVE-2017-18329 | 1 Qualcomm | 74 Mdm9615, Mdm9615 Firmware, Mdm9625 and 71 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | |||||
CVE-2017-18319 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
CVE-2018-13904 | 1 Qualcomm | 26 Mdm9206, Mdm9206 Firmware, Mdm9607 and 23 more | 2024-02-28 | 7.5 HIGH | 9.8 CRITICAL |
Improper input validation in SCM handler to access storage in TZ can lead to unauthorized access in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in versions MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 8CX, SXR1130. | |||||
CVE-2017-11004 | 1 Qualcomm | 74 Ipq8074, Ipq8074 Firmware, Mdm9206 and 71 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
CVE-2018-11268 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | |||||
CVE-2017-18124 | 1 Qualcomm | 72 Fsm9055, Fsm9055 Firmware, Ipq4019 and 69 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 | |||||
CVE-2017-18324 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016. | |||||
CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. |