Filtered by vendor Qualcomm
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2008 CVE
| CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
|---|---|---|---|---|---|
| CVE-2017-18283 | 1 Qualcomm | 18 Qca9379, Qca9379 Firmware, Sd210 and 15 more | 2024-11-21 | 6.1 MEDIUM | 6.5 MEDIUM |
| Possible memory corruption when Read Val Blob Req is received with invalid parameters in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 625, SD 835, SD 845, SD 850, SDA660. | |||||
| CVE-2017-18282 | 1 Qualcomm | 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660. | |||||
| CVE-2017-18280 | 1 Qualcomm | 42 Mdm9607, Mdm9607 Firmware, Msm8909w and 39 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function. | |||||
| CVE-2017-18279 | 1 Qualcomm | 78 Fsm9055, Fsm9055 Firmware, Fsm9955 and 75 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18278 | 1 Qualcomm | 34 Mdm9206, Mdm9206 Firmware, Mdm9607 and 31 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850. | |||||
| CVE-2017-18277 | 1 Qualcomm | 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835. | |||||
| CVE-2017-18276 | 1 Qualcomm | 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Secure camera logic allows display/secure camera controllers to access HLOS memory during secure display or camera session in Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850 | |||||
| CVE-2017-18275 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. | |||||
| CVE-2017-18274 | 1 Qualcomm | 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 | |||||
| CVE-2017-18173 | 1 Qualcomm | 26 Sd 425, Sd 425 Firmware, Sd 427 and 23 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18172 | 1 Qualcomm | 48 Mdm9635m, Mdm9635m Firmware, Sd 400 and 45 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18171 | 1 Qualcomm | 50 Qca9379, Qca9379 Firmware, Sd 205 and 47 more | 2024-11-21 | 8.3 HIGH | 8.8 HIGH |
| Improper input validation for GATT data packet received in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18170 | 1 Qualcomm | 50 Qca9379, Qca9379 Firmware, Sd 205 and 47 more | 2024-11-21 | 8.3 HIGH | 8.8 HIGH |
| Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18160 | 1 Qualcomm | 16 Mdm9635m, Mdm9635m Firmware, Mdm9645 and 13 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| AGPS session failure in GNSS module due to cyphersuites are hardcoded and needed manual update everytime in snapdragon mobile and snapdragon wear in versions MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 835, SD 845, SD 850 | |||||
| CVE-2017-18157 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | |||||
| CVE-2017-18156 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. | |||||
| CVE-2017-18155 | 1 Qualcomm | 12 Msm8996au, Msm8996au Firmware, Sd 450 and 9 more | 2024-11-21 | 4.6 MEDIUM | 7.8 HIGH |
| While playing HEVC content using HD DMB in Snapdragon Automobile and Snapdragon Mobile in version MSM8996AU, SD 450, SD 625, SD 820, SD 820A, SD 835, an uninitialized variable can be used leading to a kernel fault. | |||||
| CVE-2017-18146 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | |||||
| CVE-2017-18145 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. | |||||
| CVE-2017-18144 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. | |||||