Vulnerabilities (CVE)

Filtered by vendor Qualcomm Subscribe
Filtered by product Sd850
Total 162 CVE
CVE Vendors Products Updated CVSS v2 CVSS v3
CVE-2018-11268 1 Qualcomm 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more 2024-11-21 7.2 HIGH 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
CVE-2018-11267 1 Qualcomm 78 Mdm9206, Mdm9206 Firmware, Mdm9607 and 75 more 2024-11-21 7.2 HIGH 7.8 HIGH
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.