Filtered by vendor Qualcomm
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Total
1952 CVE
| CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
|---|---|---|---|---|---|
| CVE-2017-18282 | 1 Qualcomm | 28 Mdm9206, Mdm9206 Firmware, Mdm9607 and 25 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| Non-secure SW can cause SDCC to generate secure bus accesses, which may expose RPM access in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660. | |||||
| CVE-2017-18297 | 1 Qualcomm | 14 Sd 425, Sd 425 Firmware, Sd 430 and 11 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820. | |||||
| CVE-2017-18124 | 1 Qualcomm | 72 Fsm9055, Fsm9055 Firmware, Ipq4019 and 69 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 | |||||
| CVE-2017-18299 | 1 Qualcomm | 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more | 2024-02-28 | 4.9 MEDIUM | 5.5 MEDIUM |
| Improper translation table consolidation logic leads to resource exhaustion and QSEE error in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 | |||||
| CVE-2018-5912 | 1 Qualcomm | 18 Msm8996au, Msm8996au Firmware, Sd 450 and 15 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| Potential buffer overflow in Video due to lack of input validation in input and output values in Snapdragon Automobile, Snapdragon Mobile in MSM8996AU, SD 450, SD 625, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 | |||||
| CVE-2017-18324 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-02-28 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18302 | 1 Qualcomm | 38 Msm8996au, Msm8996au Firmware, Sd425 and 35 more | 2024-02-28 | 4.7 MEDIUM | 4.7 MEDIUM |
| In Snapdragon (Automobile ,Mobile) in version MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, a crafted HLOS client can modify the structure in memory passed to a QSEE application between the time of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions. | |||||
| CVE-2018-11822 | 1 Qualcomm | 8 Sd 835, Sd 835 Firmware, Sd 845 and 5 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| A possible integer overflow may happen in WLAN during memory allocation in Snapdragon Mobile in version SD 835, SD 845, SD 850, SDA660 | |||||
| CVE-2018-11269 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | |||||
| CVE-2018-11284 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2024-02-28 | 8.5 HIGH | 9.3 CRITICAL |
| Spoofed SMS can be used to send a large number of messages to the device which will in turn initiate a flood of registration updates with the server in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 625, SD 636, SDA660, SDM630, SDM660, SDX20 | |||||
| CVE-2018-5871 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-02-28 | 3.3 LOW | 6.5 MEDIUM |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests (for privacy reasons) is not done properly due to a flawed RNG which produces repeating output much earlier than expected. | |||||
| CVE-2018-11857 | 1 Qualcomm | 6 Sd 835, Sd 835 Firmware, Sd 845 and 3 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| Improper input validation in WLAN encrypt/decrypt module can lead to a buffer copy in Snapdragon Mobile in version SD 835, SD 845, SD 850 | |||||
| CVE-2017-18280 | 1 Qualcomm | 42 Mdm9607, Mdm9607 Firmware, Msm8909w and 39 more | 2024-02-28 | 7.2 HIGH | 7.8 HIGH |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function. | |||||
| CVE-2017-18305 | 1 Qualcomm | 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more | 2024-02-28 | 6.9 MEDIUM | 7.0 HIGH |
| XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835. | |||||
| CVE-2017-18313 | 1 Qualcomm | 20 Msm8909w, Msm8909w Firmware, Sd 205 and 17 more | 2024-02-28 | 5.7 MEDIUM | 5.3 MEDIUM |
| Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617. | |||||
| CVE-2018-11864 | 1 Qualcomm | 84 Ipq8074, Ipq8074 Firmware, Mdm9150 and 81 more | 2024-02-28 | 4.9 MEDIUM | 5.5 MEDIUM |
| Bytes can be written to fuses from Secure region which can be read later by HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2017-18277 | 1 Qualcomm | 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more | 2024-02-28 | 4.9 MEDIUM | 5.5 MEDIUM |
| When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835. | |||||
| CVE-2018-5881 | 1 Qualcomm | 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more | 2024-02-28 | 8.3 HIGH | 8.8 HIGH |
| Improper validation of buffer length checks in the lwm2m device management protocol can leads to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660 | |||||
| CVE-2018-11993 | 1 Qualcomm | 4 Mdm9206, Mdm9206 Firmware, Mdm9607 and 1 more | 2024-02-28 | 8.3 HIGH | 8.8 HIGH |
| Improper check while accessing the local memory stack on MQTT connection request can lead to buffer overflow in snapdragon wear in versions MDM9206, MDM9607 | |||||
| CVE-2018-11285 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-02-28 | 9.3 HIGH | 7.8 HIGH |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, while parsing FLAC file with corrupted picture block, a buffer over-read can occur. | |||||