Total
245 CVE
| CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
|---|---|---|---|---|---|
| CVE-2018-11864 | 1 Qualcomm | 84 Ipq8074, Ipq8074 Firmware, Mdm9150 and 81 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| Bytes can be written to fuses from Secure region which can be read later by HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2018-11855 | 1 Qualcomm | 34 Mdm9607, Mdm9607 Firmware, Mdm9650 and 31 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660. | |||||
| CVE-2018-11847 | 1 Qualcomm | 66 Ipq8074, Ipq8074 Firmware, Mdm9206 and 63 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016 | |||||
| CVE-2018-11845 | 1 Qualcomm | 80 Mdm9150, Mdm9150 Firmware, Mdm9206 and 77 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| Usage of non-time-constant comparison functions can lead to information leakage through side channel analysis in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in versions MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2018-11830 | 1 Qualcomm | 16 Mdm9206, Mdm9206 Firmware, Mdm9607 and 13 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Improper input validation in QCPE create function may lead to integer overflow in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 410/12, SD 820A | |||||
| CVE-2018-11820 | 1 Qualcomm | 92 Ipq8074, Ipq8074 Firmware, Mdm9150 and 89 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| Use of non-time constant memcmp function creates side channel that leaks information and leads to cryptographic issues in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 800, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2018-11289 | 1 Qualcomm | 84 Ipq8074, Ipq8074 Firmware, Mdm9150 and 81 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2018-11288 | 1 Qualcomm | 40 Mdm9206, Mdm9206 Firmware, Mdm9607 and 37 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Possible undefined behavior due to lack of size check in function for parameter segment_idx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDX24, SXR1130 | |||||
| CVE-2018-11279 | 1 Qualcomm | 92 Mdm9206, Mdm9206 Firmware, Mdm9607 and 89 more | 2024-11-21 | 8.3 HIGH | 8.8 HIGH |
| Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 | |||||
| CVE-2018-11264 | 1 Qualcomm | 38 Mdm9206, Mdm9206 Firmware, Mdm9607 and 35 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660. | |||||
| CVE-2018-11259 | 1 Qualcomm | 76 Mdm9206, Mdm9206 Firmware, Mdm9607 and 73 more | 2024-11-21 | 3.6 LOW | 7.7 HIGH |
| Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition. | |||||
| CVE-2017-8276 | 1 Qualcomm | 66 Mdm9206, Mdm9206 Firmware, Mdm9607 and 63 more | 2024-11-21 | 4.6 MEDIUM | 7.8 HIGH |
| Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-8252 | 1 Qualcomm | 110 Ipq4019, Ipq4019 Firmware, Ipq8074 and 107 more | 2024-11-21 | 4.9 MEDIUM | 5.5 MEDIUM |
| Kernel can inject faults in computations during the execution of TrustZone leading to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, SM7150, Snapdragon_High_Med_2016, SXR1130 | |||||
| CVE-2017-18330 | 1 Qualcomm | 78 Ipq8074, Ipq8074 Firmware, Mdm9206 and 75 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18326 | 1 Qualcomm | 68 Mdm9607, Mdm9607 Firmware, Mdm9615 and 65 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18324 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18323 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. | |||||
| CVE-2017-18322 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18320 | 1 Qualcomm | 64 Msm8996au, Msm8996au Firmware, Sd 410 and 61 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2017-18319 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||