Total
329 CVE
| CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
|---|---|---|---|---|---|
| CVE-2017-18320 | 1 Qualcomm | 64 Msm8996au, Msm8996au Firmware, Sd 410 and 61 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2017-18314 | 1 Qualcomm | 74 Mdm9206, Mdm9206 Firmware, Mdm9607 and 71 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | |||||
| CVE-2017-18311 | 1 Qualcomm | 70 Mdm9607, Mdm9607 Firmware, Mdm9635m and 67 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| XPU Master privilege escalation is possible due to improper access control of unused configuration xPU ports where unused configuration ports are open in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18310 | 1 Qualcomm | 62 Msm8909w, Msm8909w Firmware, Msm8996au and 59 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| ClientEnv exposes services 0-32 to HLOS in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 | |||||
| CVE-2017-18302 | 1 Qualcomm | 38 Msm8996au, Msm8996au Firmware, Sd425 and 35 more | 2024-11-21 | 4.7 MEDIUM | 4.7 MEDIUM |
| In Snapdragon (Automobile ,Mobile) in version MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, a crafted HLOS client can modify the structure in memory passed to a QSEE application between the time of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions. | |||||
| CVE-2017-18280 | 1 Qualcomm | 42 Mdm9607, Mdm9607 Firmware, Msm8909w and 39 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In Snapdragon (Automobile, Mobile, Wear) in version MDM9607, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDM429, SDM439, SDM632, Snapdragon_High_Med_2016, when a Trusted Application has opened the SPI/I2C interface to a particular device, it is possible for another Trusted Application to read the data on this open interface by calling the SPI/I2C read function. | |||||
| CVE-2017-18141 | 1 Qualcomm | 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18131 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
| In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2017-11004 | 1 Qualcomm | 74 Ipq8074, Ipq8074 Firmware, Mdm9206 and 71 more | 2024-11-21 | 2.1 LOW | 5.5 MEDIUM |
| A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||