Vulnerabilities (CVE)

Filtered by vendor Qualcomm Subscribe
Filtered by product Sd 835 Firmware
Total 399 CVE
CVE Vendors Products Updated CVSS v2 CVSS v3
CVE-2017-18277 1 Qualcomm 46 Mdm9206, Mdm9206 Firmware, Mdm9607 and 43 more 2024-11-21 4.9 MEDIUM 5.5 MEDIUM
When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835.
CVE-2017-18276 1 Qualcomm 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more 2024-11-21 7.2 HIGH 7.8 HIGH
Secure camera logic allows display/secure camera controllers to access HLOS memory during secure display or camera session in Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850
CVE-2017-18275 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 4.9 MEDIUM 5.5 MEDIUM
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845.
CVE-2017-18274 1 Qualcomm 32 Mdm9206, Mdm9206 Firmware, Mdm9607 and 29 more 2024-11-21 7.2 HIGH 7.8 HIGH
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
CVE-2017-18173 1 Qualcomm 26 Sd 425, Sd 425 Firmware, Sd 427 and 23 more 2024-11-21 7.2 HIGH 7.8 HIGH
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
CVE-2017-18172 1 Qualcomm 48 Mdm9635m, Mdm9635m Firmware, Sd 400 and 45 more 2024-11-21 7.2 HIGH 7.8 HIGH
In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
CVE-2017-18171 1 Qualcomm 50 Qca9379, Qca9379 Firmware, Sd 205 and 47 more 2024-11-21 8.3 HIGH 8.8 HIGH
Improper input validation for GATT data packet received in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
CVE-2017-18170 1 Qualcomm 50 Qca9379, Qca9379 Firmware, Sd 205 and 47 more 2024-11-21 8.3 HIGH 8.8 HIGH
Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016.
CVE-2017-18160 1 Qualcomm 16 Mdm9635m, Mdm9635m Firmware, Mdm9645 and 13 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
AGPS session failure in GNSS module due to cyphersuites are hardcoded and needed manual update everytime in snapdragon mobile and snapdragon wear in versions MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 835, SD 845, SD 850
CVE-2017-18157 1 Qualcomm 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more 2024-11-21 7.2 HIGH 7.8 HIGH
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
CVE-2017-18156 1 Qualcomm 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more 2024-11-21 7.2 HIGH 7.8 HIGH
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20.
CVE-2017-18155 1 Qualcomm 12 Msm8996au, Msm8996au Firmware, Sd 450 and 9 more 2024-11-21 4.6 MEDIUM 7.8 HIGH
While playing HEVC content using HD DMB in Snapdragon Automobile and Snapdragon Mobile in version MSM8996AU, SD 450, SD 625, SD 820, SD 820A, SD 835, an uninitialized variable can be used leading to a kernel fault.
CVE-2017-18146 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail.
CVE-2017-18145 1 Qualcomm 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur.
CVE-2017-18144 1 Qualcomm 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur.
CVE-2017-18142 1 Qualcomm 10 Mdm9650, Mdm9650 Firmware, Mdm9655 and 7 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile MDM9650, MDM9655, SD 835, SD 845, SD 850, while processing the IMS SIP username, a buffer overflow can occur.
CVE-2017-18141 1 Qualcomm 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more 2024-11-21 7.2 HIGH 7.8 HIGH
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVE-2017-18140 1 Qualcomm 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur.
CVE-2017-18139 1 Qualcomm 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call.
CVE-2017-18138 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 10.0 HIGH 9.8 CRITICAL
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur.