Total
417 CVE
CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
---|---|---|---|---|---|
CVE-2017-18157 | 1 Qualcomm | 42 Mdm9206, Mdm9206 Firmware, Mdm9607 and 39 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | |||||
CVE-2017-18156 | 1 Qualcomm | 24 Mdm9206, Mdm9206 Firmware, Mdm9607 and 21 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. | |||||
CVE-2017-18146 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, in some corner cases, ECDSA signature verification can fail. | |||||
CVE-2017-18145 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while the DPM native process is processing framework events, the iterator pointer is deleted after processing an event. When processing subsequent events, a Use After Condition will occur. | |||||
CVE-2017-18144 | 1 Qualcomm | 28 Msm8909w, Msm8909w Firmware, Sd 205 and 25 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing the retransmission of WPA supplicant command send failures, there is a make after break of the connection to WPA supplicant where the local pointer is not properly updated. If the WPA supplicant command transmission fails, a Use After Free condition will occur. | |||||
CVE-2017-18141 | 1 Qualcomm | 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
CVE-2017-18140 | 1 Qualcomm | 48 Mdm9206, Mdm9206 Firmware, Mdm9607 and 45 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 820A, SD 835, SD 845, when processing a call disconnection, there is an attempt to print the RIL token-id to the debug log. If eMBMS service is enabled while processing the call disconnect, a Use After Free condition may potentially occur. | |||||
CVE-2017-18139 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, a buffer overflow vulnerability may potentially exist while making an IMS call. | |||||
CVE-2017-18138 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, in GERAN, a buffer overflow may potentially occur. | |||||
CVE-2017-18136 | 1 Qualcomm | 52 Mdm9206, Mdm9206 Firmware, Mdm9607 and 49 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, in the omx aac component, a Use After Free condition may potentially occur. | |||||
CVE-2017-18133 | 1 Qualcomm | 14 Mdm9206, Mdm9206 Firmware, Mdm9607 and 11 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, an out of bound access for ebi channel array can potentially occur. | |||||
CVE-2017-18131 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
CVE-2017-18130 | 1 Qualcomm | 44 Mdm9206, Mdm9206 Firmware, Mdm9607 and 41 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 400, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 820, SD 820A, SD 835, SD 845, while playing an ASF file, a buffer over-read can potentially occur. | |||||
CVE-2017-18127 | 1 Qualcomm | 24 Msm8909w, Msm8909w Firmware, Sd 205 and 21 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 835, SD 845, while processing a SetParam command packet in the VR service, the extracted name_len and value_len values are not checked and could potentially cause a buffer overflow in subsequent calls to memcpy(). | |||||
CVE-2017-18126 | 1 Qualcomm | 70 Mdm9206, Mdm9206 Firmware, Mdm9607 and 67 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, QCA6174A, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016, the original mac spoofing feature does not use the following in probe request frames: (a) randomized sequence numbers and (b) randomized source address for cfg80211 scan, vendor scan and pno scan which may affect user privacy. | |||||
CVE-2017-18125 | 1 Qualcomm | 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, when secure camera is activated it stores captured data in protected buffers. The TEE application which uses secure camera expects those buffers to contain data captured during the current camera session. It is possible though for HLOS to put aside and reuse one or more of the protected buffers with previously captured data during next camera session. Such data reuse must be prevented as the TEE applications expects to receive valid data captured during the current session only. | |||||
CVE-2017-18124 | 1 Qualcomm | 72 Fsm9055, Fsm9055 Firmware, Ipq4019 and 69 more | 2024-11-21 | 7.2 HIGH | 7.8 HIGH |
During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 | |||||
CVE-2017-18074 | 1 Qualcomm | 46 Mdm9607, Mdm9607 Firmware, Mdm9625 and 43 more | 2024-11-21 | 10.0 HIGH | 9.8 CRITICAL |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 615/16/SD 415, SD 800, SD 808, SD 810, SD 820, SD 835, while playing a .wma file with modified media header with non-standard bytes per second parameter value, a reachable assert occurs. | |||||
CVE-2017-18073 | 1 Qualcomm | 18 Mdm9206, Mdm9206 Firmware, Mdm9607 and 15 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 820, SD 820A, SD 835, the HLOS can gain access to unauthorized memory. | |||||
CVE-2017-18072 | 1 Qualcomm | 76 Mdm9206, Mdm9206 Firmware, Mdm9607 and 73 more | 2024-11-21 | 5.0 MEDIUM | 7.5 HIGH |
In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016, the probe requests originated from user's phone contains the information elements which specifies the supported wifi features. This shall impact the user's privacy if someone sniffs the probe requests originated by this DUT. Hence, control the presence of which information elements is supported. |