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"published": "2022-09-16T06:15:10.487", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-190"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music"}, {"lang": "es", "value": "Corrupci\u00f3n de memoria en bluetooth debido a un desbordamiento de enteros mientras es procesado el perfil HFP-UNIT en Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music"}], "lastModified": "2022-09-20T13:17:06.497", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*", 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