CVE-2022-22096

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"published": "2022-09-02T12:15:09.770", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin", "tags": ["Patch", "Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-787"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in Bluetooth HOST due to stack-based buffer overflow when when extracting data using command length parameter in Snapdragon Connectivity, Snapdragon Mobile"}, {"lang": "es", "value": "Una corrupci\u00f3n de memoria en Bluetooth HOST debido a un desbordamiento del b\u00fafer en la regi\u00f3n stack de la memoria cuando son extra\u00eddos datos usando el par\u00e1metro de longitud del comando en Snapdragon Connectivity, Snapdragon Mobile"}], "lastModified": "2023-04-19T17:10:55.030", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": 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