A potential security vulnerability has been identified in HP ThinPro 7.2 Service Pack 8 (SP8). The security vulnerability in SP8 is not remedied after upgrading from SP8 to Service Pack 9 (SP9). HP has released Service Pack 10 (SP10) to remediate the potential vulnerability introduced in SP8.
References
Link | Resource |
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https://support.hp.com/us-en/document/ish_6415074-6415171-16/hpsbhf03789 | Vendor Advisory |
https://support.hp.com/us-en/document/ish_6415074-6415171-16/hpsbhf03789 | Vendor Advisory |
Configurations
Configuration 1 (hide)
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History
21 Nov 2024, 06:41
Type | Values Removed | Values Added |
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References | () https://support.hp.com/us-en/document/ish_6415074-6415171-16/hpsbhf03789 - Vendor Advisory |
Information
Published : 2022-09-13 15:15
Updated : 2024-11-21 06:41
NVD link : CVE-2022-1602
Mitre link : CVE-2022-1602
CVE.ORG link : CVE-2022-1602
JSON object : View
Products Affected
hp
- thinpro
- mt21
- t628
- t630
- t420
- mt45
- t638
- t430
- mt46
- mt32
- t530
- t730
- t540
- mt22
- t240
- t740
CWE