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"confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2020-11-12T10:15:12.967", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-190"}, {"lang": "en", "value": "CWE-787"}]}], "descriptions": [{"lang": "en", "value": "u'Possible integer overflow to heap overflow while processing command due to lack of check of packet length received' in Snapdragon Auto, Snapdragon Compute, Snapdragon Mobile in QSM8350, SA6145P, SA6150P, SA6155, SA6155P, SA8150P, SA8155P, SA8195P, SDX55M, SM8250, SM8350, SM8350P, SXR2130, SXR2130P"}, {"lang": "es", "value": "Un posible desbordamiento de enteros para un desbordamiento de pila mientras se procesa el comando debido a una falta de comprobaci\u00f3n de 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