{"id": "CVE-2020-11155", "metrics": {"cvssMetricV2": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"version": "2.0", "baseScore": 8.3, "accessVector": "ADJACENT_NETWORK", "vectorString": "AV:A/AC:L/Au:N/C:C/I:C/A:C", "authentication": "NONE", "integrityImpact": "COMPLETE", "accessComplexity": "LOW", "availabilityImpact": "COMPLETE", "confidentialityImpact": "COMPLETE"}, "acInsufInfo": false, "impactScore": 10.0, "baseSeverity": "HIGH", "obtainAllPrivilege": false, "exploitabilityScore": 6.5, "obtainUserPrivilege": false, "obtainOtherPrivilege": false, "userInteractionRequired": false}], "cvssMetricV31": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 8.8, "attackVector": "ADJACENT_NETWORK", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 2.8}]}, "published": "2020-11-02T07:15:13.670", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin", "tags": ["Broken Link"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins/october-2020-security-bulletin", "tags": ["Vendor Advisory"], "source": "nvd@nist.gov"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins/october-2020-bulletin", "tags": ["Broken Link"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-120"}]}], "descriptions": [{"lang": "en", "value": "u'Buffer overflow while processing PDU packet in bluetooth due to lack of check of buffer length before copying into it.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55"}, {"lang": "es", "value": "Un desbordamiento del b\u00fafer mientras se procesa el paquete PDU en bluetooth debido a una falta de comprobaci\u00f3n de la longitud del b\u00fafer antes de copiarlo en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en versiones APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55"}], "lastModified": "2024-11-21T04:56:57.220", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": 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