{"id": "CVE-2019-10604", "metrics": {"cvssMetricV2": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"version": "2.0", "baseScore": 7.2, "accessVector": "LOCAL", "vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C", "authentication": "NONE", "integrityImpact": "COMPLETE", "accessComplexity": "LOW", "availabilityImpact": "COMPLETE", "confidentialityImpact": "COMPLETE"}, "acInsufInfo": false, "impactScore": 10.0, "baseSeverity": "HIGH", "obtainAllPrivilege": false, "exploitabilityScore": 3.9, "obtainUserPrivilege": false, "obtainOtherPrivilege": false, "userInteractionRequired": false}], "cvssMetricV31": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2020-03-05T09:15:16.313", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin", "tags": ["Vendor Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-787"}]}], "descriptions": [{"lang": "en", "value": "Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"}, {"lang": "es", "value": "Una posibilidad de desbordamiento del b\u00fafer de la pila durante la \u00faltima iteraci\u00f3n del bucle mientras se llena la informaci\u00f3n de la versi\u00f3n de la imagen en el paquete de respuesta del comando diag, en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables en las versiones APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130"}], "lastModified": "2024-11-21T04:19:33.653", "configurations": [{"nodes": [{"negate": 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