{"id": "CVE-2019-10569", "metrics": {"cvssMetricV2": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"version": "2.0", "baseScore": 7.2, "accessVector": "LOCAL", "vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C", "authentication": "NONE", "integrityImpact": "COMPLETE", "accessComplexity": "LOW", "availabilityImpact": "COMPLETE", "confidentialityImpact": "COMPLETE"}, "acInsufInfo": false, "impactScore": 10.0, "baseSeverity": "HIGH", "obtainAllPrivilege": false, "exploitabilityScore": 3.9, "obtainUserPrivilege": false, "obtainOtherPrivilege": false, "userInteractionRequired": false}], "cvssMetricV31": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", 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SM6150, SM7150, SM8150, SXR1130"}, {"lang": "es", "value": "Un desbordamiento del b\u00fafer de la pila debido a que el id de la instancia est\u00e1 colocado inapropiadamente dentro de la definici\u00f3n de los efectos acelerados del hardware en makefile en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile en las versiones APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130."}], "lastModified": "2024-11-21T04:19:28.580", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:apq8053_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "B052615D-857A-46D4-9098-1CBFA14687C6"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:apq8053:-:*:*:*:*:*:*:*", "vulnerable": false, "matchCriteriaId": "19B59B60-A298-4A56-A45A-E34B7AAB43D7"}], "operator": "OR"}], "operator": 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