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"confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 3.9}]}, "published": "2018-07-06T17:29:01.710", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins", "tags": ["Vendor Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-119"}]}], "descriptions": [{"lang": "en", "value": "While sending the response to a RIL_REQUEST_GET_SMSC_ADDRESS message, a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear."}, {"lang": "es", "value": "Al enviar la respuesta a un mensaje RIL_REQUEST_GET_SMSC_ADDRESS, podr\u00eda ocurrir un desbordamiento de b\u00fafer en Snapdragon Automobile, Snapdragon Mobile y Snapdragon Wear."}], 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