{"id": "CVE-2018-11866", "metrics": {"cvssMetricV2": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"version": "2.0", "baseScore": 7.2, "accessVector": "LOCAL", "vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C", "authentication": "NONE", "integrityImpact": "COMPLETE", "accessComplexity": "LOW", "availabilityImpact": "COMPLETE", "confidentialityImpact": "COMPLETE"}, "acInsufInfo": true, "impactScore": 10.0, "baseSeverity": "HIGH", "obtainAllPrivilege": false, "exploitabilityScore": 3.9, "obtainUserPrivilege": false, "obtainOtherPrivilege": false, "userInteractionRequired": false}], "cvssMetricV30": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.0", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2018-10-29T18:29:02.370", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-190"}]}], "descriptions": [{"lang": "en", "value": "Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016."}, {"lang": "es", "value": "Podr\u00eda ocurrir un desbordamiento de enteros en WLAN al calcular un tama\u00f1o de estructura interna debido a la falta de validaci\u00f3n de la longitud de las entradas en Snapdragon Mobile y Snapdragon Wear en versiones IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710 y Snapdragon_High_Med_2016."}], "lastModified": "2018-12-07T15:27:35.647", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:ipq8074_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "2914BF98-E69C-4C8D-8B10-759642ADD7B4"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:ipq8074:-:*:*:*:*:*:*:*", "vulnerable": false, "matchCriteriaId": "2118C404-402F-463C-8160-3CC3B703DF30"}], "operator": "OR"}], "operator": "AND"}, {"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": 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