CVE-2017-18297

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"confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2018-10-23T13:29:01.760", "references": [{"url": "http://www.securitytracker.com/id/1041432", "tags": ["Third Party Advisory", "VDB Entry"], "source": "product-security@qualcomm.com"}, {"url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components", "tags": ["Third Party Advisory"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}, {"url": "http://www.securitytracker.com/id/1041432", "tags": ["Third Party Advisory", "VDB Entry"], "source": "af854a3a-2127-422b-91ae-364da2661108"}, {"url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components", "tags": ["Third Party Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins", "tags": ["Vendor Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-415"}]}], "descriptions": [{"lang": "en", "value": "Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820."}, {"lang": "es", "value": "Doble liberaci\u00f3n (double free) de memoria al cerrar la gesti\u00f3n de la sesi\u00f3n de la API TEE SE en Snapdragon Mobile en la versi\u00f3n SD 425, SD 430, SD 450, SD 625, SD 650/52 y SD 820."}], "lastModified": "2024-11-21T03:19:48.017", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sd_425_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "C56BC939-2FE8-4AB4-B638-35C83B224005"}], "operator": "OR"}, {"negate": false, 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